Philipp Schmidbauer’s practice involves patent prosecution before the German Patent and Trademark Office and the European Patent Office in the fields of wireless communications, electronics and computer technologies.
He has a technical background in the fields of electronics, antenna technology, and high frequency engineering.
P. Schmidbauer, M. Wojnowski, K. Pressel, R. Weigel and A. Hagelauer: Recent trends in wafer-level package technology in 2020 IEEE MTT-S International Wireless Symposium (IWS), pp. 1-3, Sept. 2020
P. Schmidbauer, M. Wojnowski, R. Weigel and A. Hagelauer: Concepts for a monostatic radar transceiver front-end in eWLB package with off-chip quasi-circulator for 60 GHz in IEEE 20th Electronics Packaging Technology Conference (EPTC), pp. 8–12, Dec. 2018
P. Schmidbauer, M. Wojnowski, R. Weigel and A. Hagelauer: Wafer level package integrated antenna concepts for circular polarization in IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 285–287, Oct. 2018